MJT5050 Datasheet, PDF (7/17 Pages) Seoul Semiconductor – Acrich2 Modular Solutions Overview

1. Component
1.4 Handling Precautions
During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to
pierce the sealing compound.
In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can
also become scratched.
When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that
mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than
the LED’s reflector area.
Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling
of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned
previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles
cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components.
SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the
package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed
space.
Avoid leaving fingerprints on silicone resin parts.
1.5 Optical Characteristics & Mechanical Files support
Optical characteristics and mechanical file for MJT5050 are available on the Seoul-semiconductor website at www.seoulsemicon.com
Copyright ⓒ Seoul Semiconductor Co., Ltd.
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