YGURHT811-BS Datasheet, PDF (5/9 Pages) Seoul Semiconductor – Top View LED

6. Soldering Profile
(1) Reflow Soldering Conditions / Profile (Lead Free Solder)
Temp
[°C]
260
240
220
200
180
150
Pre-heating
Rising
5 °C/sec
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
Cooling
-5 °C/sec
0
Time
[Hr]
(2) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(3) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using the chip mounter, the picking up nozzle that does not affect the
silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
SSC-QP-0401-06(REV.0.4)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : [phone]~6
- 5/10 -
SSC-YGURHT811-BS