THBTGFR422 Datasheet, PDF (4/7 Pages) Seoul Semiconductor – CHIP LED DEVICE

5. Outline Dimension
1.5
34
Marking
(0.18)
Resin
2
1
0.2
0.8
PCB
0.4
0.2
0.6
6. Packing
1.5
+0.1
-0
4.0 ^±0.1
2.0 ^±0.05
Tolerance: ±0.1, Unit: ㎜
[Inner Circuit Diagram]
12
3
4
Anode
Common
0.2
1.8
[Recommended Solder Pattern]
0.2 ^±0.05
4.0 ^±0.1
±0.05
0.5
1.73 ^±0.05
180
+0
-3
0.7 ^±0.05
11.4
9 ^±0.3
13 ^±0.2
2 ^±0.2
22
Label
Tolerance: ±0.2, Unit: ㎜
(1) Quantity : 4000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off
from the carrier tape at 10˚ angle to be the carrier tape.
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: [phone] FAX: [phone]
-4/7 -
SSC-THBTGFR422