THBTGFR421-KR Datasheet, PDF (4/8 Pages) Seoul Semiconductor – CHIP LED DEVICE

5. Outline Dimension
Tolerance: ±0.1, Unit: ㎜
Anode(Common)
6. Packing
±0.05
1.5
+0.1
-0
4.0 ^±0.1
2.0 ^±0.05
Cathode
[Recommended Solder Pattern]
0.2 ^±0.05
4.0 ^±0.1
±0.05
0.5
1.73^±0.05
180
+0
-3
0.7 ^±0.05
11.4
9 ^±0.3
13 ^±0.2
2 ^±0.2
22
Label
(1) Quantity : 4000pcs/Reel
Tolerance: ±0.2, Unit: ㎜
(2) Cumulative Tolerance : Cumulative Tolerance/10pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off
from the carrier tape at 10˚ angle to be the carrier tape.
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: [phone] FAX: [phone]
- 4/8 -
SSC-HBTGFR421-KR