STW0Q14A Datasheet, PDF (4/18 Pages) Seoul Semiconductor – Pb-Free Reflow soldering application RoHS copliant

2. Absolute maximum ratings^*1
Parameter
Symbol
Value
Unit
Power Dissipation
Forward Current
Peak Forward Current
Operating Temperature
Storage Temperature
Junction Temperature
P_d
I_F
I_FM ^[2]
T_opr
T_stg
Tj
272
80
150
-40 ~ +85
-40 ~ +100
125
mW
mA
mA
℃
℃
℃
[1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
≤ ≤ [2] IFM was measured at Tw 1 msec of pulse width and D 1/10 of duty ratio.
[3] LED’s properties might be different from suggested values like above and below tables if operation condition
will be exceeded our parameter range.
3. Electric characteristics
Parameter
Forward Voltage *^[1]
Reverse Voltage
Luminous Intensity*^[2]
Luminous flux
Color Correlated Temperature
Viewing Angle ^[3]
Color Rendering Index*
ESD (HBM)
Thermal resistance ^[4]
Symbol
V_F
V_R
I_v
Φ
CCT
Θ2 _1/2
Ra
RthJS
Condition
I_F=60mA
I_R=5mA
I_F=60mA
I_F =60mA
I_F =60mA
I_F=60mA
I_F=60mA
1.5kΩ;100pF
I_F=60mA
Min.
2.9
-
-
-
4700
-
-
5
Typ.
3.2
0.85
5.2
15
-
120
68
-
22
Max.
3.4
1.2
-
-
8200
-
-
-
Unit
V
V
cd
lm
K
deg.
-
KV
ºC/W
[1] Forward current is 60mA per die.
[2] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned
with the mechanical axis of the LED package.
Θ [3] 2 1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[4] Thermal resistance: R_thJS (Junction / solder), Metal PCB 25*25mm 1.6t
* Tolerance : VF :± 0.1V, IV :± 10%, x,y :± 0.01
[Note] All measurements were made under the standardized environment of SSC.
Rev. 02
April, 2011
Document No. : SSC- QP- 7- 07- 24