BW104-S Datasheet, PDF (4/10 Pages) Seoul Semiconductor – CHIP LED DEVICE

-Not more than 3 seconds @MAX280℃, under Soldering iron.
5. Outline dimension
Tolerance: ±0.1, Unit: ㎜
0.18
Resin
Polarity Mark
Cathode
PCB
0.8
0.4 ^±0.05
6. Reel packing structure
1.5
+0.1
-0
4.0 ^±0.1
2.0 ^±0.05
Anode
0.8
[Recommended Solder Pattern]
0.2 ^±0.05
4.0 ^±0.1
0.5 ^±0.08
0.95 ^±0.05
180
+0
-3
0.5 ^±0.05
11.4
9 ^±0.3
13 ^±0.2
2 ^±0.2
22
Label
Tolerance ±0.2, Unit : mm
(1) Quantity : 4000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off
from the carrier tape at 10℃ angle to be the carrier tape
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: [phone] FAX: [phone]
- 4/9 -
SSC-BW104-S