X42180-08 Datasheet, PDF (24/26 Pages) Seoul Semiconductor – Super high flux output and high luminance

8. Soldering
IPC/JEDEC J-STD-020C
Profile Feature
Average ramp-up rate (Tsmax to Tp)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak
Temperature (tp)2
Ramp-down Rate
Time 25°C to Peak Temperature
Sn-Pb Eutectic Assembly
3° C/second max.
100 °C
150 °C
60-120 seconds
183 °C
60-150 seconds
215℃
10-30 seconds
6 °C/second max.
6 minutes max.
Pb-Free Assembly
3° C/second max.
150 °C
200 °C
60-180 seconds
217 °C
60-150 seconds
260℃
20-40 seconds
6 °C/second max.
8 minutes max.
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
OCTOBER 2012
24
www.seoulsemicon.com
Document No. : SSC-QP-7-07-12 (Rev.02)