SZ5M Datasheet, PDF (22/24 Pages) Seoul Semiconductor – Super high Flux output and high Luminance

Reflow Soldering Conditions / Profile
IPC/JEDEC J-STD-020C
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak Temperature (Tp)
183 °C
60-150 seconds
℃ 215
217 °C
60-150 seconds
℃ 260
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
SSC-SZ5M
January 2012
www.seoulsemicon.com
22
서식번호 : SSC- QP- 7- 07- 12 (Rev.02)