F10390 Datasheet, PDF (19/21 Pages) Seoul Semiconductor – Power LED TECHNICAL DATA

20. Soldering Profile
(1) Reflow Soldering Conditions / Profile
Temp
[°C]
260
240
220
200
180
150
Pre-heating
Rising
5 °C/sec
Tm : Reflow machine setting temp
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
Cooling
-5 °C/sec
0
Time
[Hr]
(2) Hand Soldering conditions
- Lead : Not more than 3 seconds @MAX280℃
- Slug : Use a thermal-adhesives
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairing should not be done after the LEDs have been soldered. When repairing is
unavoidable, suitable tools have to be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : [phone] FAX : [phone]
Rev06 – 2005/09
19