SHBK07 Datasheet, PDF (16/16 Pages) Seoul Semiconductor – Specification

11. precaution for use
(1) Storage conditions
•
Keep the product in a dry box or a desiccator with a desiccant in order to prevent
moisture absorption.
a.
Keep it at a temperature in the range from 5^°C to 30^°C and at a humidity of less
than 60% RH.
•
In case of being stored for more than 3 months, the product should be sealed with
Nitrogen gas.
(2) After opening the package .
•
When soldering, this could result in a decrease of the photoelectric effect or light
intensity.
a.
Soldering should be done right after mounting the product.
b.
Keep the temperature in the range from 5^°C to 40^°C and the humidity at less
than 30%.
•
Soldering should be done within 7 days after opening the desiccant package.
If the product has been exposed for more than 7 days after opening the package or
the indicating color of the desiccator changes, the product must be baked at a
temperature between 60^°C and 65^°C for 10 to 12 hours.
•
An unused and unsealed product should be repacked in a desiccant package and kept
sealed in a dry atmosphere.
(3) Precautions for use
•
Any external mechanical force or excessive vibration should not be applied to the
product during cooling after soldering, and it is preferable to avoid rapid cooling.
•
The product should not be mounted on a distorted part of PCB.
•
Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to
prevent ESD and surge damage, and all devices and equipments must be grounded to
the earth.
(4) Miscellaneous
•
Radiation resistance is not considered.
•
When cleaning the product, any kind of fluid such as water, oil and organic solvent
must not be used and IPA(Isopropyl Alcohol) must be used.
•
When using the product, operating current should be settled in consideration of the
maximum ambient temperature.
•
Its appearance or specification for improvement is subject to change without notice.
Rev. 00
March 2009
www.acriche.com
Document No. : SSC-QP-7-07-24 (Rev.00)