W47180 Datasheet, PDF (13/17 Pages) Seoul Semiconductor – Z Power LED

3. Reflow Soldering Conditions / Profile
Pre-heating
Rising
5 °C/sec
Cooling
-5 °C/sec
4. Hand Soldering conditions
Lead : Not more than 3 seconds @MAX280
Slug : Use a thermal-adhesives
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable, suitable tools have to be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
Rev. 00
May 2008
13
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