SF101 Datasheet, PDF (1/1 Pages) Shanghai Lunsure Electronic Tech – SUPER FAST RECTIFIER

SF101~SF107
SUPER FAST RECOVERY SILICON DIODES
Reverse Voltage – 50 to 1000 Volts
Forward Current – 1.0 Ampere
Features
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0.
• Void free moulded plastic technique
• Fast switching for high efficiency
• High forward surge current capability
• High temperature soldering:250℃/10s,
0.375”(9.5mm) lead length, 5lbs(2.3Kg) tension
Mechanical Data
• Case: DO-41 plastic moulded
• Terminals: Lead –Tin plated axial leads, solderable
per MIL-STD-750, method 2026
• Polarity: Colored band (silver) denotes cathode
• Mounting position: Any
Absolute Maximum Ratings and Characteristics
Rating at 25℃ ambient temperature unless otherwise specified.
Symbols _{SF101 SF102 SF103 SF104 SF105 SF106 SF107} Units
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward
Rectified Current 0.375” Lead Length at T_A = 50 ^OC
Peak Forward Surge Current
8.3ms single half sine-wave superimposed on
rated load (MIL-STD-750D 4065 method)
Maximum Forward Voltage at 1.0A
Maximum DC Reverse Current at Ta = 25 ^OC
at Rated DC Blocking Voltage at Ta = 125 ^OC
V_RRM
V_RMS
V_DC
I_(AV)
I_FSM
V_F
I_R
50 100 200 400 600 800 1000 V
35 70 140 280 420 560 700 V
50 100 200 400 600 800 1000 V
1.0
A
30
A
1.0
1.25
1.4
V
5.0
uA
400
Maximum Time of Reverse Recovery (note1)
Trr
35
nS
Typical Junction Capacitance(note2)
Cj
Typical Thermal Resistance(note3)
Rja
Operating Junction Temperature
Tj
Storage Temperature Range
Ts
22
50
-55 to +150
-55 to +150
pF
O_C/W
O_C
O_C
Notes: 1.Rverse recovery test conditions: I_F = 0.5A, I_R = 1.0A, Irr = 0.25A.
2.Measured at 1.0MHz and applied reverse voltage of 4.0V
3.Thermal resistance from junction ambient and from junction to lead at 9.5mm lead length, P.C.B mounted.
SEMTECH ELECTRONICS LTD.
(Subsidiary of Sino-Tech International Holdings Limited, a company
listed on the Hong Kong Stock Exchange, Stock Code: 724)
®
Dated : 02/05/2003