SFC05-4_04 Datasheet, PDF (7/8 Pages) Semtech Corporation – ChipClampΤΜ Flip Chip TVS Diode Array

PROTECTION PRODUCTS
Outline Drawing - 3x2 Grid Flip Chip
A
INDEX AREA
A1 CORNER
1.47±0.03
B
0.97±0.03
SFC05-4
PRELIMINARY
0.10 C
0.40-0.60
0.50-0.75
C
0.05 C
3.
0.50
B
0.50
A
0.150±0.025
6X Ø0.175-0.225
0.005 C A B
12 3
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS
2. REFERENCE JEDEC REGISTRATION MO-211.
3. Sn63/Pb37 FOR STANDARD DEVICES OR SN95.5/Ag3.8/Cu0.7
FOR Pb-FREE DEVICES
Land Pattern - 3x2 Grid Flip Chip
 2004 Semtech Corp.
7
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