E118AHF Datasheet, PDF (7/11 Pages) Semtech Corporation – Low Skew Clock Spreader

EDGE HIGH-PERFORMANCE PRODUCTS
Package Information (continued)
e/2
–A, B, D– ₃
DETAIL "A"
A2 _{– 0.10 S}
A1
Edge118
0.40 MIN.
˚^{0 MIN.}
0.13
R. MIN.
0.13 / 0.30 R.
C
C
L
1.60 REF.
DETAIL "B"
˚ ^{0 – 7}
GAGE PLANE
0.25
˚ ^{12 – 16}
1.41 REF.
˚ ^{12 – 16}
SEE DETAIL "B"
A
H2
0.076
C
12 0.13 / 0.23
SECTION C-C
8
b
ccc M C A – B S D S
WITH LEAD FINISH
0.13 / 0.17
b1
BASE METAL
Notes:
1. All dimensions and tolerances conform to ANSI Y14.5-1982.
2. Datum plane -H- located at mold parting line and coincident with lead,
where lead exits plastic body at bottom of parting line.
3. Datums A-B and -D- to be determined at centerline between leads where
leads exit plastic body at datum plane -H-.
4. To be determined at seating plane -C-.
5. Dimensions D1 and E1 do not include mold protrusion. Allowable mold
protrusion is 0.254 mm per side. Dimensions D1 and E1 do
include mold mismatch and are determined at datum plane -H.-.
6. N” is the total # of terminals.
7. Package top dimensions are smaller than bottom dimensions by
0.20 mm, and top of package will not overhang bottom of package.
8. Dimension b does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm total in excess of the b dimension at
maximum material condition. Dambar cannot be located on the lower
radius or the foot.
9. All dimensions are in millimeters.
10. Maximum allowable die thickness to be assembled in this package family
is 0.635 millimeters.
11. This drawing conforms to JEDEC registered outlines MO-108 and
MS-022.
12. These dimensions apply to the flat section of the lead between 0.10 mm
and 0.25 mm from the lead tip.
 2000 Semtech Corp.
7
JEDEC Variation
All Dimensions in Millimeters
Min.
A
A1 0.10
A2 2.55
D
D1
D2
Z0
E
E1
E2
ZE
L 0.73
N
e
b 0.30
b1 0.30
ccc
AC
Nom.
2.82
0.15
2.67
17.20 BSC.
14.00 BSC.
12.00 BSC.
1.00 REF.
17.20 BSC.
14.00 BSC.
12.00 BSC.
1.00 REF.
.088
64
0.80 BSC.
0.35
0.16
Max.
3.00
0.25
2.75
Note
4
5
4
5
1.03
6
0.45
0.40
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