GX3190 Datasheet, PDF (46/47 Pages) Semtech Corporation – Crosspoint Switch with Trace Equalization and Output De-emphasis

6.4 Solder Reflow Profile
The GX3190 is available in a Pb-free package. It is recommended that the Pb-free
package be soldered with Pb-free paste using the reflow profile shown in Figure 6-3.
Device Surface Temperature (°C)
250
1.0 - 2.0°C/s
Peak 245°C
230°C
200
180°C
150
150°C
Pre Heating Zone
60 - 120s
Soldering
Zone
100
10 - 15s
1.5 - 2.0°C/s
50
1.0 - 2.0°C/s
Heating Time
Figure 6-3: Maximum Pb-free Solder Reflow Profile
6.5 Ordering Information
Table 6-2: Ordering Information
Part Number
GX3190-CBE3
Package
50x50mm HFC-BGA
Temperature Range
0°C to 85°C
Appendix - Relevant Documentation
Table 6-3: Relevant Documentation
Document Description
Document Identification
EB-GX3290 Schematics, PCB Layout and Bill of Materials
GX3290 Host Control Software User Manual
Using the Monitoring Features of the GX3290 Application Note
GX3290 (and family) Crosspoint Ball Guide
Crosspoint Design Guide
Crosspoint (GX3290 and family) Reference Manual (for CSRs)
GENDOC-056057
GENDOC-055970
GENDOC-058329
GENDOC-056697
GENDOC-056004
GENDOC-056832
GX3190 146 x 290 3.5Gb/s Crosspoint
Final Data Sheet Rev. 2
GENDOC-056076 March 2013
www.semtech.com
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