SC4624_08 Datasheet, PDF (19/20 Pages) Semtech Corporation – Low Input Voltage, High Efficiency, 4A Integrated FET Synchronous Step down DC/DC Regulator

POWER MANAGEMENT
Outline Drawing - MLPQ - 20
A
D
PIN 1
INDICATOR
(LASER MARK)
A
aaa C
A1
D1
E1
2
1
B
E
A2
DIMENSIONS
DIM
INCHES
MIN NOM MAX
MILLIMETERS
MIN NOM MAX
A .031 .035 .039 0.80 0.90 1.00
A1 .000 .001 .002 0.00 0.02 0.05
A2 - (.008) - - (0.20) -
b .007 .010 .012 0.18 0.25 0.30
D .154 .157 .161 3.90 4.00 4.10
D1 .100 .106 .110 2.55 2.70 2.80
E .154 .157 .161 3.90 4.00 4.10
E1 .100 .106 .110 2.55 2.70 2.80
e
.020 BSC
0.50 BSC
L .012 .016 .020 0.30 0.40 0.50
N
20
20
aaa
.004
0.10
bbb
.004
0.10
SEATING
PLANE
C
LxN
E/2
N
e
D/2
bxN
bbb
CAB
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - MLPQ - 20
SC4624
K
(C) H
G
Z
Y
DIMENSIONS
DIM
INCHES
MILLIMETERS
C
(.156)
G
.122
H
.106
K
.106
P
.020
X
.010
Y
.033
Z
.189
(3.95)
3.10
2.70
2.70
0.50
0.25
0.85
4.80
X
P
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
 2008 Semtech Corp.
19
www.semtech.com