GS6080 Datasheet, PDF (16/19 Pages) Semtech Corporation – Input signal trace equalization

6.2 Recommended PCB Footprint
0.35
0.65
0.55
3.70
2.76
CENTER PAD
Note: All dimensions
are in millimeters.
2.76
3.70
Figure 6-2: Recommended PCB Footprint
The Center Pad should be connected to the most negative power supply plane (VEE) by
a minimum of 5 vias.
Note: Suggested dimensions only. Final dimensions should conform to customer
design rules and process optimizations.
6.3 Packaging Data
Table 6-1: Packaging Data
Parameter
Package type / dimensions / pad pitch
Package Drawing Reference
Moisture Sensitivity Level
Junction to Case Thermal Resistance, θ_j-c
Junction to Air Thermal Resistance, θ_j-a (at zero airflow)
Psi, Ψ
Pb-free and RoHS compliant, Halogen-free
Value
16-pin QFN / 4mm x 4mm /
0.65mm
JEDEC M0220
1
31.0°C/W
43.8°C/W
11.0°C/W
Yes
GS6080
Final Data Sheet
PDS-060045
Rev.6
September 2014
www.semtech.com
16 of 19
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