UCLAMP3306P Datasheet, PDF (1/8 Pages) Semtech Corporation – Low Voltage TVS for ESD Protection

PROTECTION PRODUCTS - MicroClamp^TM
Description
The μClamp^TM series of TVS arrays are designed to
protect sensitive electronics from damage or latch-up
due to ESD, lightning, and other voltage-induced
transient events. Each device will protect up to six lines
operating at 3.3 volts.
The μClamp^TM3306P is a solid-state device designed
specifically for transient suppression. It is constructed
using Semtech’s proprietary EPD process technology.
The EPD process provides low standoff voltages with
significant reductions in leakage currents and capaci-
tance over traditional pn junction processes. They offer
desirable characteristics for board level protection
including fast response time, low clamping voltage and
no device degradation.
The μClamp3306P may be used to meet the immunity
requirements of IEC 61000-4-2, level 4 (±15kV air,
±8kV contact discharge). It is packaged in an ultra
small SLP1616P6 package with a low profile of only
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small package
makes it ideal for use in portable electronics such as cell
phones, digital still cameras, and notebook computers.
uClamp3306P
Low Voltage TVS
for ESD Protection
Features
‹ Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
‹ Small package for use in portable electronics
‹ Protects Six I/O
‹ Working voltage: 3.3V
‹ Low leakage current
‹ Low operating and clamping voltages
‹ Solid-state silicon-avalanche technology
Mechanical Characteristics
‹ SLP1616P6 package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 1.6 x 1.6 x 0.58 mm
‹ Lead Pitch: 0.5mm
‹ Lead Finish: NiPd
‹ Marking : Orientation Mark and Marking Code
‹ Packaging : Tape and Reel per EIA 481
Applications
‹ Cellular handsets and accessories
‹ Notebooks and handhelds
‹ MP3 Players
‹ Digital cameras
‹ Portable instrumentation
Circuit Diagram
1
2
3
4
5
6
Center Tab (GND)
Device Schematic
Revision 01/17/2007
Package
1.6
1
1.6
6
0.5
0.6
6 Pin SLP package (Bottom Side View)
1.6 x 1.6 x 0.58mm (Nominal)
1
www.semtech.com