TCLAMP0602N Datasheet, PDF (1/7 Pages) Semtech Corporation – Low Capacitance TVS for Ethernet and Telecom Interfaces

TClamp0602N
Low Capacitance TVS
for Ethernet and Telecom Interfaces
PROTECTION PRODUCTS - TransClamp^ΤΜ
Description
A TransClamp^ΤΜ is a low capacitance TVS array de-
signed to protect high speed data interfaces. This
series has been specifically designed to protect sensi-
tive components which are connected to data and
transmission lines from overvoltage caused by ESD
(electrostatic discharge), CDE (Cable Discharge
Events), and Lightning.
These devices integrate low capacitance, surge-rated
compensation diodes with a high power transient
voltage suppressor (TVS). The compensation diodes
are arranged in a bridge pattern allowing the device to
be connected in common mode and/or differential
mode. This allows the designer maximum flexibility and
reduces parts count. The capacitance of the device is
limited to 12pF maximum from line-to-line to ensure
correct signal transmission on high-speed lines.
These devices may be used to meet Bellcore GR-1089-
CORE short-haul (intra-building) surge requirements and
will withstand a minimum 100 A surge for a 2/10μs
pulse.
The TClamp^TM0602N is in a 10-pin, RoHS/WEEE
compliant, SLP2626P10 package. It measures 2.6 x
2.6 x 0.60mm. The leads are spaced at a pitch of
0.5mm and are finished with lead-free NiPdAu. They
are particularly well suited for applications where board
space is at a premium such as integrated connectors/
magnetics and T1/E1 equipment.
Features
‹ Transient protection for high-speed data lines to
Bellcore 1089 (Intra-Building) 100A (2/10μs)
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) L5, 95A (8/20μs)
‹ Protects two lines in common and differential mode
‹ Low capacitance (12pF line-to-line)
‹ Low operating voltages (6V)
‹ Low clamping voltage
‹ Small SLP Package saves board space
‹ Solid-state technology
Mechanical Characteristics
‹ SLP2626P10 10L package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 2.6 x 2.6 x 0.60 mm
‹ Lead Pitch: 0.5mm
‹ Molding compound flammability rating: UL 94V-0
‹ Marking: Marking Code
‹ Packaging: Tape and Reel
Applications
‹ T1/E1
‹ T3/E3
‹ 10/100 Ethernet
‹ Integrated Magnetics
‹ Carrier Class Equipment
‹ ISDN Interfaces
Circuit Diagram
Package Configuration
LINE 1
(1, 2, 3)
Center Tab
2.60
1 2 ^CL
CL ^2.60
0.50 BSC
LINE 2
(8, 9, 10)
Revision 5/23/2007
0.60
10 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1
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