SFC3.3-4 Datasheet, PDF (1/7 Pages) Semtech Corporation – Low Voltage ChipClampΤΜ Flip Chip TVS Diode Array

PROTECTION PRODUCTS
Description
The SFC3.3-4 is a quad flip chip TVS diode array. They
are state-of-the-art devices that utilize solid-state EPD
TVS technology for superior clamping performance and
DC electrical characteristics. The SFC series TVS
diodes are designed to protect sensitive semiconduc-
tor components from damage or latch-up due to
electrostatic discharge (ESD) and other voltage in-
duced transient events.
The SFC3.3-4 is a 6-bump, 0.5mm pitch flip chip array
with a 3x2 bump grid. It measures approximately 1.5
by 1.0 mm. It has a very low profile of < 0.65 mm.
This is a crucial specification for many portable applica-
tions. Each device will protect up to four data or I/O
lines. The flip chip design results in lower inductance,
virtually eliminating voltage overshoot due to leads and
interconnecting bond wires.
The devices are constructed using Semtech’s propri-
etary EPD process technology. The EPD process pro-
vides low standoff voltages with significant reductions
in leakage currents and capacitance over silicon-
avalanche diode processes.
They may be used to meet the ESD immunity require-
ments of IEC 61000-4-2, Level 4 (±15kV air, ±8kV
contact discharge).
SFC3.3-4
Low Voltage ChipClamp^ΤΜ
Flip Chip TVS Diode Array
Features
‹ 150 Watts peak pulse power (tp = 8/20µs)
‹ Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (8/20µs)
‹ Small chip scale package requires less board space
‹ Low profile (< 0.65mm)
‹ No need for underfill material
‹ Protects four I/O or data lines
‹ Low clamping voltage
‹ Working voltage: 3.3V
‹ Solid-state EPD TVS technology
Mechanical Characteristics
‹ JEDEC MO-211, 0.50 mm Flip Chip Package
‹ Non-conductive top side coating
‹ Marking : Marking Code
‹ Packaging : Tape and Reel
Applications
‹ Cell Phone Handsets and Accessories
‹ Personal Digital Assistants (PDAs)
‹ Notebook and Hand Held Computers
‹ Portable Instrumentation
‹ Pagers
‹ Smart Cards
‹ MP3 Players
Device Dimensions
Schematic & PIN Configuration
B
SFC3.3-4 Maximum Dimensions (mm)
A
1
2
3
3 x 2 Grid Flip Chip TVS (Bottom View)
Revision 11/13/2008
1
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