RCLAMP7524T Datasheet, PDF (1/9 Pages) Semtech Corporation – Low Capacitance RClamp 4-Line ESD protection

PROTECTION _{PRODUCTS - RailClamp}^®
Description
RailClamp^® TVS arrays are ultra low capacitance ESD
protection devices designed to protect high speed data
interfaces. This series has been specifically engineered
to protect sensitive components which are connected
to high-speed data and transmission lines from over-
voltage caused by ESD (electrostatic discharge), CDE
(Cable Discharge Events), and EFT (electrical fast
transients).
The RClamp^®7524T will protect four lines or two
differential pairs. Each line has a maximum capaci-
tance of only 0.60pF between any I/O pin and ground.
This allows it to be used on circuits operating in excess
of 5GHz without signal attenuation. They feature high
maximum ESD withstand voltage of +/- 25kV contact,
+/-30kV air discharge per IEC 61000-4-2.
The RClamp7524T is in a 5-pin SLP1308N5T package.
It measures 1.3 x 0.8mm with a nominal height of
0.40mm. The innovative flow through package design
simplifies pcb layout and allows matched trace lengths
for consistant impedance between high speed differen-
tial lines.
The combination of small size, low capacitance, and high
level of ESD protection makes this device a flexible solu-
tion for applications such as HDMI, MHL, MDDI, and eDP
interfaces.
RClamp7524T
Low Capacitance RClamp^®
4-Line ESD protection
PRELIMINARY
Features
 ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
 Package design optimized for high speed lines
 Flow-Through design
 Protects four high-speed lines
 Low capacitance: 0.60pF Maximum (I/O to Ground)
 Low ESD clamping voltage
 Low dynamic resistance: 0.50 Ohms (Typ)
 Solid-state silicon-avalanche technology
Mechanical Characteristics
 SLP1308N5T 5-pin package (1.3 x 0.8 x 0.40mm)
 Pb-Free, Halogen Free, RoHS/WEEE Compliant
 Lead Pitch: 0.45mm
 Lead finish: NiPdAu
 Marking: Marking Code
 Packaging: Tape and Reel
Applications
 HDMI 1.3 and HDMI 1.4
 V-By-One
 USB 3.0
 MHL
 eDP
 LVDS Interfaces
 eSATA Interfaces
Dimensions
0.45 BSC
1.30
12
0.80
0.50 BSC
Circuit Diagram
1
3
4
5
0.40
Nominal Dimensions in mm (Bottom View)
Revision 7/25/2013
1
2
4-Line Protection
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