RCLAMP2504P_08 Datasheet, PDF (1/11 Pages) Semtech Corporation – RailClamp® 2.5V & 3.3V TVS Arrays

RClamp2504P & RClamp3304P
RailClamp^®
PROTECTION PRODUCTS - RailClamp^®
2.5V & 3.3V TVS Arrays
Description
Features
RailClamp^® is a low capacitance TVS array designed to
protect high speed data interfaces. This series has been
specifically designed to protect sensitive components
which are connected to data and transmission lines from
overvoltage caused by ESD (electrostatic discharge), CDE
(Cable Discharge Events), and EFT (electrical fast tran-
sients).
The monolithic design incorporates surge rated, low
capacitance steering diodes and a TVS diode in a single
package. Each line has a maximum capacitance of
< 0.8pF to ground. The capacitance of each line is well
matched for consistant signal balance. This device is
optimized for ESD protection of portable electronics. It
may be used to meet the ESD immunity requirements
of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact
discharge).
The RClamp^TM2504P and RClamp^TM3304P are con-
structed using Semtech’s proprietary EPD process
technology. The EPD process provides low standoff
voltages with significant reductions in leakage current
and capacitance over silicon-avalanche diode pro-
cesses. They feature a true operating voltage of 2.5
volts and 3.3 volts for superior protection.
These devices are in a 6-pin, RoHS/WEEE compliant,
SLP1616P6 package measuring 1.6 x 1.6 x 0.58mm.
The leads are spaced at a pitch of 0.5mm and are
finished with lead-free NiPdAu.
‹ Transient protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
‹ Array of surge rated diodes with internal TVS Diode
‹ Small package saves board space
‹ Protects up to four I/O lines
‹ Low capacitance (<0.8pF) for high-speed interfaces
‹ Minimal insertion loss to 3.0GHz
‹ Low operating voltage: 2.5V and 3.3V
‹ Low leakage current and clamping voltage
‹ Solid-state silicon-avalanche technology
Mechanical Characteristics
‹ SLP1616P6 package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 1.6 x 1.6 x 0.58 mm
‹ Lead Finish: NiPdAu
‹ Molding compound flammability rating: UL 94V-0
‹ Marking: Marking Code + Date Code
‹ Packaging: Tape and Reel
Applications
‹ Multi Media Card (MMC) Interfaces
‹ SATA Interfaces
‹ SD Card Interfaces
‹ SIM Ports
‹ MDDI Ports
‹ MPPI Ports
Circuit Diagram
Pin Configuration
3
1
2
5
6
GND
1.6
1
6
0.5
1.6
0.58
Revision 01/15/2008
SLP1616P6 (Bottom View)
Nominal Dimensions in mm
1
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