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ECLAMP2456P Datasheet, PDF (1/8 Pages) Semtech Corporation – ESD/EMI Protection for Color LCD Interfaces | |||
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PROTECTION PRODUCTS - EMIClampTM
Description
The EClampTM2456P is a (L-C) low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD and camera lines in cellular phones and other
portable electronics.
The device consists of six identical circuits comprised
of TVS diodes for ESD protection, and a 5-pole induc-
tor - capacitor network for EMI/RFI filtering. A typical
inductor value of 28nH and a capacitor value of 12pF
are used to achieve 40dB minimum attenuation at
800MHz. The TVS diodes provide effective suppression
of ESD voltages in excess of ±15kV (air discharge) and
±8kV (contact discharge) per IEC 61000-4-2, level 4.
The EClamp2456P is in a 12-pin, RoHS/WEEE compli-
ant, SLP3016P12 package. It measures 3.0 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack-
age makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and PDAs.
EClamp2456P
ESD/EMI Protection
for Color LCD Interfaces
Features
PRELIMINARY
 Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
 ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
 Filter performance: 40dB minimum attenuation at
800MHz to 2.7GHz
 TVS working voltage: 5V
 Inductor: 28nH (Typical)
 Capacitance: 12pF (Typical at VR = 2.5V)
 Protection and filtering for six lines
 Solid-state technology
Mechanical Characteristics
 SLP3016P12 12-pin package
 RoHS/WEEE Compliant
 Nominal Dimensions: 3.0 x 1.6 x 0.58 mm
 Lead Pitch: 0.5mm
 Lead finish: NiPd
 Marking: Marking Code
 Packaging: Tape and Reel per EIA 481
Applications
 Color LCD Protection
 Cell Phone CCD Camera Lines
 Clamshell Cell Phones
Circuit Diagram (Each Line)
Package Configuration
L1
L2
IN
C1
C2
C3
OUT
GND
3.00
12
1.60
0.50 BSC
0.58
Device Schematic (6X)
Revision 03/29/2006
12 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1
www.semtech.com
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