ECLAMP2454P Datasheet, PDF (1/8 Pages) Semtech Corporation – ESD/EMI Protection for Color LCD Interfaces

EClamp2454P
ESD/EMI Protection
for Color LCD Interfaces
PROTECTION PRODUCTS - EMIClamp^TM
PRELIMINARY
Description
Features
The EClamp^TM2454P is a (L-C) low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD and camera lines in cellular phones and other
portable electronics.
The device consists of four identical circuits comprised
of TVS diodes for ESD protection, and a 5-pole induc-
tor - capacitor network for EMI/RFI filtering. A typical
inductor value of 28nH and a capacitor value of 12pF
are used to achieve 40dB minimum attenuation at
800MHz. The TVS diodes provide effective suppression
of ESD voltages in excess of ±15kV (air discharge) and
±8kV (contact discharge) per IEC 61000-4-2, level 4.
The EClamp2454P is in a 8-pin, RoHS/WEEE compliant,
SLP2116P8 package. It measures 2.1 x 1.6 x 0.58mm.
The leads are spaced at a pitch of 0.5mm and are
finished with lead-free NiPd. The small package makes it
ideal for use in portable electronics such as cell phones,
digital still cameras, and PDAs.
‹ Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
‹ Filter performance: 40dB minimum attenuation at
800MHz to 2.7GHz
‹ TVS working voltage: 5V
‹ Inductor: 28nH (Typical)
‹ Capacitors: 12pF (Typical at VR = 2.5V)
‹ Protection and filtering for four lines
‹ Solid-state technology
Mechanical Characteristics
‹ SLP2116P8 8-pin package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 2.1 x 1.6 x 0.58 mm
‹ Lead Pitch: 0.5mm
‹ Lead finish: NiPd
‹ Marking: Marking Code
‹ Packaging: Tape and Reel per EIA 481
Applications
‹ Color LCD Protection
‹ Cell Phone CCD Camera Lines
‹ Clamshell Cell Phones
Circuit Diagram (Each Line)
Package Configuration
L1
L2
IN
C1
C2
C3
OUT
GND
2.10
12
1.60
0.50 BSC
0.58
Device Schematic (4X)
Revision 03/29/2006
8 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1
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