ECLAMP2410P Datasheet, PDF (1/9 Pages) Semtech Corporation – ESD Protecton Device for T-Flash/MicroSD Interfaces

PROTECTION PRODUCTS - EMIClamp^TM
Description
The EClamp^TM2410P is a combination EMI filter and line
termination device with integrated TVS diodes for use on
Multimedia Card interfaces. This state-of-the-art de-
vice utilizes solid-state silicon-avalanche technology for
superior clamping performance and DC electrical char-
acteristics. They have been optimized for protection of
T-Flash/MicroSD interfaces in cellular phones and other
portable electronics.
The device consists of six circuits that include series im-
pedance matching resistors and pull up resistors as re-
quired by the SD specification. TVS diodes are included
on each line for ESD protection. An additional TVS diode
connection is included for protection of the voltage (Vdd)
bus. Termination resistor value of 45 Ohms is included
on the DAT0, DAT1, DAT2, DAT3, CMD, and CLK lines.
Pull up resistors of 15k Ohms are included on DAT0,
DAT1, DAT2, and CMD lines while a 50k Ohm pull up is
inlcuded on the DAT3 line. These may be configured for
devices operating in SD or SPI mode . The TVS diodes
provide effective suppression of ESD voltages in excess
of ±15kV (air discharge) and ±8kV (contact discharge)
per IEC 61000-4-2, level 4.
The EClamp2410P is in a 16-pin, RoHS/WEEE compliant,
SLP4016P16 package. It measures 4.0 x 1.6 x 0.58mm.
The leads are spaced at a pitch of 0.5mm and are fin-
ished with lead-free NiPd.
EClamp2410P
ESD Protection Device
for T-Flash/MicroSD Interfaces
PRELIMINARY
Features
Bidirectional EMI/RFI filtering and line termination
with integrated ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
TVS working voltage: 5V
Termination Resistors: 45Ω
Pull Up Resistors: 15kΩ (3 each) and 50kΩ
Typical Capacitance per Line: 12pF (VR = 2.5V)
Protection and termination for six lines + Vdd
Solid-state technology
Mechanical Characteristics
SLP4016P16 16-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 4.0 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead finish: NiPd
Marking: Marking Code
Packaging: Tape and Reel per EIA 481
Applications
T-Flash / MicroSD Interfaces
MMC Interfaces
CDMA, GSM, 3G Cell Phones
Pin Configuration
Package Configuration
D AT 1 In 1
D AT0 In
C L K In
R up1
Vd d
C MD In
D AT3 In
D AT2 In
16 _{D AT1 O u t}
D AT0 O u t
C LK Out
R up3
R up2
C MD Out
D AT3 O u t
D AT2 O u t
4.00
12
1.60
0.50 BSC
0.58
Pin Designation (Top View)
Revision 07/20/2006
16 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1
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