ECLAMP2388P Datasheet, PDF (1/8 Pages) Semtech Corporation – ESD/Emi Protection for Color LCD Interfaces

EClamp2388P
ESD/EMI Protection
for Color LCD Interfaces
PROTECTION PRODUCTS - EMIClamp^TM
PRELIMINARY
Description
Features
The EClamp^TM2388P is a low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD panels in cellular phones and other portable
electronics.
The device consists of eight identical circuits comprised
of TVS diodes for ESD protection, and a resistor -
capacitor network for EMI/RFI filtering. A series
resistor value of 200Ω and a capacitance value of 12pF
are used to achieve 30dB minimum attenuation from
800MHz to 2.7GHz. The TVS diodes provide effective
suppression of ESD voltages in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 61000-
4-2, level 4.
The EClamp2388P is in a 16-pin, RoHS/WEEE compli-
ant, SLP4016P16 package. It measures 4.0 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack-
age makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and PDAs.
‹ Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
‹ Filter performance: 30dB minimum attenuation
800MHz to 2.7GHz
‹ TVS working voltage: 5V
‹ Resistor: 200Ω +/− 15%
‹ Typical Capacitance: 12pF (VR = 2.5V)
‹ Protection and filtering for eight lines
‹ Solid-state technology
Mechanical Characteristics
‹ SLP4016P16 16-pin package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 4.0 x 1.6 x 0.58 mm
‹ Lead Pitch: 0.5mm
‹ Lead finish: NiPd
‹ Marking: Marking Code
‹ Packaging: Tape and Reel per EIA 481
Applications
‹ Color LCD Protection
‹ Cell Phone CCD Camera Lines
‹ CDMA/GSM Cell Phones
Circuit Diagram (Each Line)
Package Configuration
200 Ω
IN
OUT
12pF 12pF
GND
4.00
12
1.60
0.50 BSC
0.58
Device Schematic (8X)
Revision 1/25/2006
16 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1
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