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ECLAMP2386K Datasheet, PDF (1/8 Pages) Semtech Corporation – ESD/EMI Protection for Color LCD Interfaces | |||
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PROTECTION PRODUCTS - EMIClampTM
Description
The EClampTM2386K is a low pass filter array with
integrated TVS diodes. It is designed to suppress un-
wanted EMI/RFI signals and provide electrostatic dis-
charge (ESD) protection in portable electronic equip-
ment. This state-of-the-art device utilizes solid-state
silicon-avalanche technology for superior clamping
performance and DC electrical characteristics. It has
been optimized for protection of color LCD panels
in cellular phones and other portable electronics.
The device consists of six identical circuits comprised
of TVS diodes for ESD protection, and a resistor -
capacitor network for EMI/RFI filtering. A series
resistor value of 200Ω and a capacitance value of 12pF
are used to achieve 30dB minimum attenuation from
800MHz to 2.7GHz. The TVS diodes provide effective
suppression of ESD voltages in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 61000-
4-2, level 4.
The EClamp2386K is in a 12-pin, RoHS/WEEE compli-
ant, SLP2513P12 package. It measures 2.5 x 1.3 x
0.50mm. The leads are spaced at a pitch of 0.4mm
and are finished with lead-free NiPdAu. The small
package makes it ideal for use in portable electronics
such as cell phones, digital still cameras, and PDAs.
EClamp2386K
ESD/EMI Protection
for Color LCD Interfaces
Features
PRELIMINARY
 Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
 ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
 Filter performance: 30dB minimum attenuation
800MHz to 2.7GHz
 TVS working voltage: 5V
 Resistor: 200Ω +/â 15%
 Total Capacitance: 12pF (VR = 2.5V)
 Protection and filtering for six lines
 Solid-state technology
Mechanical Characteristics
 SLP2513P12 12-pin package
 RoHS/WEEE Compliant
 Nominal Dimensions: 2.5 x 1.3 x 0.50 mm
 Lead Pitch: 0.4mm
 Lead finish: NiPdAu
 Marking: Marking Code
 Packaging: Tape and Reel per EIA 481
Applications
 Color LCD Protection
 Cell Phone CCD Camera Lines
 Clamshell Cell Phones
Circuit Diagram (Each Line)
Package Configuration
200 Ω
IN
OUT
12pF 12pF
GND
2.50
12
1.30
0.40 BSC
0.50
Device Schematic (6X)
Revision 03/26/2007
12 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1
www.semtech.com
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