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ECLAMP2384P Datasheet, PDF (1/8 Pages) Semtech Corporation – ESD/EMI Protection for Color LCD Interfaces | |||
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EClamp2384P
ESD/EMI Protection
for Color LCD Interfaces
PROTECTION PRODUCTS - EMIClampTM
PRELIMINARY
Description
Features
The EClampTM2384P is a low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD panels in cellular phones and other portable
electronics.
The device consists of four identical circuits comprised
of TVS diodes for ESD protection, and a resistor -
capacitor network for EMI/RFI filtering. A series
resistor value of 200⦠and a capacitance value of 12pF
are used to achieve 30dB minimum attenuation from
800MHz to 2.7GHz. The TVS diodes provide effective
suppression of ESD voltages in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 61000-
4-2, level 4.
The EClamp2384P is in a 8-pin, RoHS/WEEE compliant,
SLP2116P8 package. It measures 2.1 x 1.6 x 0.58mm.
The leads are spaced at a pitch of 0.5mm and are
finished with lead-free NiPd. The small package makes it
ideal for use in portable electronics such as cell phones,
digital still cameras, and PDAs.
 Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
 ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
 Filter performance: 30dB minimum attenuation
800MHz to 2.7GHz
 TVS working voltage: 5V
 Resistor: 200⦠+/â 15%
 Typical Capacitance: 12pF (VR = 2.5V)
 Protection and filtering for four lines
 Solid-state technology
Mechanical Characteristics
 SLP2116P8 8-pin package
 RoHS/WEEE Compliant
 Nominal Dimensions: 2.1 x 1.6 x 0.58 mm
 Lead Pitch: 0.5mm
 Lead finish: NiPd
 Marking: Marking Code
 Packaging: Tape and Reel per EIA 481
Applications
 Color LCD Protection
 Cell Phone CCD Camera Lines
 Clamshell Cell Phones
Circuit Diagram (Each Line)
Package Configuration
200 â¦
IN
OUT
12pF 12pF
GND
2.10
12
1.60
0.50 BSC
0.58
Device Schematic (4X)
Revision 1/25/2006
8 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1
www.semtech.com
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