ECLAMP2374K Datasheet, PDF (1/8 Pages) Semtech Corporation – ESD/EMI Protection for Color LCD Interfaces

PROTECTION PRODUCTS - EMIClamp^TM
Description
The EClamp^TM2374K is a low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD panels in cellular phones and other portable
electronics.
The device consists of four identical circuits comprised
of TVS diodes for ESD protection, and a resistor -
capacitor network for EMI/RFI filtering. A series
resistor value of 100Ω and a capacitance value of 10pF
are used to achieve 30dB minimum attenuation from
1.8GHz to 2.5GHz. The TVS diodes provide effective
suppression of ESD voltages in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 61000-
4-2, level 4.
The EClamp2374K is in a 8-pin, RoHS/WEEE compliant,
SLP1713P8 package. It measures 1.7 x 1.3 x
0.50mm. The leads are spaced at a pitch of 0.4mm
and are finished with lead-free NiPdAu. The small
package makes it ideal for use in portable electronics
such as cell phones, digital still cameras, and PDAs.
EClamp2374K
ESD/EMI Protection
for Color LCD Interfaces
Features
PRELIMINARY
‹ Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
‹ Filter performance: 30dB minimum attenuation
1.8GHz to 2.5GHz
‹ TVS working voltage: 5V
‹ Resistor: 100Ω +/− 15%
‹ Typical Capacitance: 20pF (VR = 0V)
‹ Protection and filtering for four lines
‹ Solid-state technology
Mechanical Characteristics
‹ SLP1713P8 8-pin package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 1.7 x 1.3 x 0.50 mm
‹ Lead Pitch: 0.4mm
‹ Lead finish: NiPdAu
‹ Marking : Marking Code
‹ Packaging : Tape and Reel
Applications
‹ Color LCD Protection
‹ Cell Phone CCD Camera Lines
‹ Clamshell Cell Phones
Circuit Diagram (Each Line)
Package Configuration
100 Ω
IN
OUT
10pF 10pF
GND
1.70
12
1.30
0.40 BSC
0.50
Device Schematic (4X)
Revision 1/30/2008
8 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1
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