SK50MLI07F3D1P Datasheet, PDF (3/6 Pages) Semikron International – One screw mounting module

SK50MLI07F3D1p
SEMITOP^® 3 Press-Fit
3-Level NPC Inverter
SK50MLI07F3D1p
Target Data
Features
• One screw mounting module
• Solder free mounting with Press-Fit
terminals
• Fully compatible with other SEMITOP^®
Press-Fit types
• Improved thermal performances by
aluminium oxide substrate
• 650V Fast Trench IGBT technology
• CAL4F technology FWD
• Rapid switching clamping diode
technology
• UL recognized, file no. E 63 532
Remarks*
• Recommended T_jop= -40 ... +150°C
• IGBT1: outer IGBTs T1 & T4
• IGBT2: inner IGBTs T2 & T3
• Diode1: outer Diodes D1 & D4
• Diode2: inner Diodes D2 & D3
• Diode5: clamping diodes D5 & D6
Characteristics
Symbol Conditions
Diode1
V_F = V_EC ^IF ^{= 50 A}
chiplevel
V_F0
chiplevel
r_F
chiplevel
I_RRM
Q_rr
E_rr
I_F = 50 A
V_R = 300 V
V_GE = +15/-8 V
R_th(j-s)
Diode2
V_F = V_EC
per Diode
I_F = 50 A
chiplevel
V_F0
chiplevel
r_F
chiplevel
I_RRM
Q_rr
E_rr ¹⁾
I_F = 50 A
V_R = 300 V
V_GE = +15/-8 V
R_th(j-s)
Diode5
V_F = V_EC
per Diode
I_F = 60 A
chiplevel
V_F0
chiplevel
r_F
chiplevel
I_RRM
Q_rr
E_rr
I_F = 60 A
V_R = 300 V
V_GE = +15/-8 V
R_th(j-s)
per Diode
T_j = 25 °C
T_j = 150 °C
T_j = 25 °C
T_j = 150 °C
T_j = 25 °C
T_j = 150 °C
T_j = 150 °C
T_j = 150 °C
T_j = 150 °C
T_j = 25 °C
T_j = 150 °C
T_j = 25 °C
T_j = 150 °C
T_j = 25 °C
T_j = 150 °C
T_j = 150 °C
T_j = 150 °C
T_j = 150 °C
T_j = 25 °C
T_j = 150 °C
T_j = 25 °C
T_j = 150 °C
T_j = 25 °C
T_j = 150 °C
T_j = 150 °C
T_j = 150 °C
T_j = 150 °C
min.
typ.
max. Unit
1.37
1.73
V
1.35
1.72
V
1.04
1.24
V
0.85
0.99
V
6.7
9.8
mΩ
10
15
mΩ
A
µC
0.95
mJ
1.55
K/W
1.37
1.73
V
1.35
1.72
V
1.04
1.24
V
0.85
0.99
V
6.7
9.8
mΩ
10
15
mΩ
A
µC
-
mJ
1.55
K/W
1.35
1.77
V
1.30
1.72
V
0.95
1.15
V
0.75
0.95
V
6.7
10
mΩ
9.2
13
mΩ
A
µC
0.69
mJ
0.93
K/W
MLI
© by SEMIKRON
Rev. 0.2 – 24.02.2016
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