SEMIX653GD176HDC_09 Datasheet, PDF (2/5 Pages) Semikron International – Trench IGBT Modules

SEMiX653GD176HDc
SEMiX^® 33c
Trench IGBT Modules
SEMiX653GD176HDc
Features
• Homogeneous Si
• Trench = Trenchgate technology
• V_CE(sat) with positive temperature
coefficient
• UL recognised file no. E63532
Typical Applications*
• AC inverter drives
• UPS
• Electronic welders
Characteristics
Symbol Conditions
Inverse diode
V_F = V_EC
I_F = 450 A
V_GE = 0 V
chip
T_j = 25 °C
T_j = 125 °C
V_F0
r_F
I_RRM
Q_rr
E_rr
R_th(j-c)
T_j = 25 °C
T_j = 125 °C
T_j = 25 °C
T_j = 125 °C
I_F = 450 A
T_j = 125 °C
di/dt_off = 4200 A/µs
V_GE = -15 V
T_j = 125 °C
V_CC = 1200 V
T_j = 125 °C
per diode
Module
L_CE
R_CC'+EE'
res., terminal-chip ^{TC = 25 °C}
T_C = 125 °C
R_th(c-s)
M_s
M_t
per module
to heat sink (M5)
to terminals (M6)
w
Temperatur Sensor
R₁₀₀
B_100/125
T_c=100°C (R₂₅=5 kΩ)
R_(T)=R₁₀₀exp[B_100/125(1/T-1/T₁₀₀)];
T[K];
min.
typ.
max. Unit
1.7
1.90
V
1.7
1.9
V
0.9
1.1
1.3
V
0.7
0.9
1.1
V
1.3
1.3
1.3
mΩ
1.8
1.8
1.8
mΩ
380
A
130
µC
73
mJ
0.11 K/W
20
nH
0.7
mΩ
1
mΩ
0.014
K/W
3
5
Nm
2.5
5
Nm
Nm
900
g
493 ± 5%
Ω
3550
±2%
K
GD
2
Rev. 11 – 16.12.2009
© by SEMIKRON