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SEMIX353GD176HDC_07 Datasheet, PDF (2/5 Pages) Semikron International – Trench IGBT Modules
SEMiX 353GD176HDc
SEMiX® 33c
Trench IGBT Modules
Characteristics
Symbol Conditions
Inverse Diode
;  
;)
;
%$$"
C

%;   **+ 27 5  ) 
%;   **+ 2
&G&  4))) 2G:
.  *+ , <
.  (*+ , <
.  *+ ,
.  (*+ ,
.  *+ ,
.  (*+ ,
.  (*+ ,
5  >(+ 7   (*)) 
$.>I
Module
  &&
min.
typ.
(-++
(-+
(-(
)-@
*
*-0
*3)
31
4+
max. Units
(-0+

(-0

(-1

(-(

A
A
2
:
D
)-(1 FGH
SEMiX 353GD176HDc
Preliminary Data
Features
   
        
         
  
     !
Typical Applications
J
$K?K
 <-   >
  *+ ,
  (*+ ,
$> 
  & 
"
    L "+
"
    "=

Temperature sensor
$())
E())G(*+
()), $*++ LA
$$()) #OE())G(*+(G>(G())P7
OFP7 E
*)

)-0
A
(
A
)-)(4
FGH
1
+
M
*-+
+
M
@))

)-4@16+N
LA
1++)6*N
F
 "#    
 $    %   
      %   
Remarks
    !    & '
()))    
      & '
(*))
This is an electrostatic discharge sensitive device (ESDS), international standard
IEC 60747-1, Chapter IX.
This technical information specifies semiconductor devices but promises no
characteristics. No warranty or guarantee expressed or implied is made regarding
delivery, performance or suitability.
GD
2
17-04-2007 SCH
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