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SEMIX353GD176HDC_07 Datasheet, PDF (2/5 Pages) Semikron International – Trench IGBT Modules | |||
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SEMiX 353GD176HDc
SEMiX® 33c
Trench IGBT Modules
Characteristics
Symbol Conditions
Inverse Diode
;
;)
;
%$$"
C
%;
**+ 27 5 )
%;
**+ 2
&G& 4))) 2G:
. *+ , <
. (*+ , <
. *+ ,
. (*+ ,
. *+ ,
. (*+ ,
. (*+ ,
5 >(+ 7 (*))
$.>I
Module
&&
min.
typ.
(-++
(-+
(-(
)-@
*
*-0
*3)
31
4+
max. Units
(-0+
(-0
(-1
(-(
A
A
2
:
D
)-(1 FGH
SEMiX 353GD176HDc
Preliminary Data
Features
!
Typical Applications
J
$K?K
<-
>
*+ ,
(*+ ,
$>
&
"
L "+
"
"=
Temperature sensor
$())
E())G(*+
()), $*++ LA
$$()) #OE())G(*+(G>(G())P7
OFP7 E
*)
)-0
A
(
A
)-)(4
FGH
1
+
M
*-+
+
M
@))
)-4@16+N
LA
1++)6*N
F
"#
$
%
%
Remarks
! & '
()))
& '
(*))
This is an electrostatic discharge sensitive device (ESDS), international standard
IEC 60747-1, Chapter IX.
This technical information specifies semiconductor devices but promises no
characteristics. No warranty or guarantee expressed or implied is made regarding
delivery, performance or suitability.
GD
2
17-04-2007 SCH
© by SEMIKRON
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