SKR16_10 Datasheet, PDF (1/2 Pages) Semikron International – DIODE

SKR 16,3 x 18,2 Qu bond
DIODE
I_F(DC) = 365 A
V_RRM = 1600 V
Size: 16,3 mm x 18,2 mm
SKR 16,3 x 18,2 Qu bond
Features
• high current density due to mesa
technology
• high surge current
• compatible to thick wire bonding
• compatible to all standard solder
processes
Typical Applications*
• uncontrolled rectifier bridges
Absolute Maximum Ratings
Symbol Conditions
V_RRM
I_F(AV)
i²t
I_FSM
T_jmax
T_j = 25 °C, I_R = 0.4 mA
T_c = 80 °C, T_j = 150 °C
T_j = 150 °C, 10 ms, sin 180°
10 ms
T_j = 25 °C
sin 180°
T_j = 150 °C
Electrical Characteristics
Symbol Conditions
I_R
V_F
V_(TO)
r_T
t_rr
T_j = 25 °C, V_RRM
T_j = 120 °C, V_RRM
T_j = 25 °C, I_F = 320 A
T_j = 125 °C, I_F = 320 A
T_j = 125 °C
T_j = 125 °C
T_j = 25 °C, ± 1 A
Thermal Characteristics
Symbol Conditions
T_j
T_stg
T_solder
T_solder
R_th(j-c)
10 min.
5 min.
Semipack 2 assembly
Mechanical Characteristics
Symbol Conditions
Raster
size
Area total
Anode
Cathode
Wire bond
Package
Chips /
Package
Values
1600
305
130100
6600
5100
150
Unit
V
A
A²s
A
A
°C
min.
typ.
max. Unit
0.4
mA
2.2
mA
1
1.21
V
0.9
1.1
V
0.83
V
0.5
mΩ
49
µs
min.
-40
-40
typ.
0.185
max. Unit
150
°C
150
°C
250
°C
320
°C
K/W
Values
16.3 x 18.2
296.66
bondable (Al)
solderable (Ag/Ni)
Al, diameter ≤ 500 µm
tray
20
Unit
mm²
mm²
pcs
SKR
© by SEMIKRON
Rev. 1 – 19.02.2010
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