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SKIM429GD17E4HD Datasheet, PDF (1/5 Pages) Semikron International – Trench IGBT Modules
SKiM429GD17E4HD
SKiM® 93
Trench IGBT Modules
SKiM429GD17E4HD
Features
• IGBT 4 Trench Gate Technology
• Solderless sinter technology
• Low inductance case
• Isolated by AL2O3 DCB (Direct Copper
Bonded) ceramic substrate
• Pressure contact technology for
thermal contacts and electrical
contacts
• High short circuit capability, self
limiting to 6 x IC
• Integrated temperature sensor
Typical Applications
• Automotive inverter
• High reliability AC inverter wind
• High reliability AC inverter drives
Absolute Maximum Ratings
Symbol Conditions
IGBT
VCES
IC
Tj = 175 °C
Ts = 25 °C
Ts = 70 °C
ICnom
ICRM
VGES
tpsc
Tj
ICRM = 3xICnom
VCC = 1200 V
VGE ≤ 15 V
VCES ≤ 1700 V
Tj = 150 °C
Inverse diode
IF
IFnom
IFRM
IFSM
Tj
Tj = 150 °C
Ts = 25 °C
Ts = 70 °C
IFRM = 2xIFnom
tp = 10 ms, sin 180°, Tj = 25 °C
Module
It(RMS)
Tstg
Visol
AC sinus 50 Hz, t = 1 min
Characteristics
Symbol Conditions
IGBT
VCE(sat)
VCE0
rCE
VGE(th)
ICES
Cies
Coes
Cres
QG
RGint
td(on)
tr
Eon
td(off)
tf
Eoff
Rth(j-s)
IC = 420 A
VGE = 15 V
chiplevel
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VGE = 15 V
Tj = 25 °C
Tj = 125 °C
VGE=VCE, IC = 16.8 mA
VGE = 0 V
VCE = 1700 V
Tj = 25 °C
VCE = 25 V
VGE = 0 V
f = 1 MHz
f = 1 MHz
f = 1 MHz
VGE = - 8 V...+ 15 V
Tj = 25 °C
VCC = 1200 V
IC = 420 A
Tj = 125 °C
Tj = 125 °C
RG on = 3.6 Ω
Tj = 125 °C
RG off = 3.6 Ω
Tj = 125 °C
di/dton = 5200 A/µs
di/dtoff = 2200 A/µs
Tj = 125 °C
Tj = 125 °C
per IGBT
Values
1700
595
479
420
1260
-20 ... 20
10
-40 ... 175
413
298
450
900
3699
-40 ... 150
700
-40 ... 125
3300
Unit
V
A
A
A
A
V
µs
°C
A
A
A
A
A
°C
A
°C
V
min.
typ.
max. Unit
1.90
2.25
V
2.1
2.3
V
1.1
1.2
V
1
1.1
V
1.9
2.5
mΩ
2.6
2.9
mΩ
5.2
5.8
6.4
V
0.15
0.45 mA
mA
33
nF
1.38
nF
1.08
nF
6660
nC
2.7
Ω
390
ns
80
ns
245
mJ
1005
ns
170
ns
180
mJ
0.079 K/W
GD
© by SEMIKRON
Rev. 4 – 11.12.2009
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