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SKCD81C120I4F Datasheet, PDF (1/2 Pages) Semikron International – CAL-DIODE | |||
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SKCD 81 C 120 I4F
CAL-DIODE
IF = 150 A
VRRM = 1200 V
Size: 9 mm x 9 mm
SKCD 81 C 120 I4F
Features
⢠max. junction 175 °C
⢠very low forward voltage drop
⢠positive temperature coefficient
⢠extreme soft recovery
Typical Applications*
⢠freewheeling diode for IGBT
Absolute Maximum Ratings
Symbol Conditions
VRRM
IF(AV)
IFSM
Tjmax
Tj = 25 °C, IR = 0.18 mA
Tc = 80 °C, Tj = 175 °C, Fi=PI/2
10 ms
Tj = 25 °C
sin 180°
Tj = 150 °C
Electrical Characteristics
Symbol Conditions
i²t
IR
VF
V(TO)
rT
V(TO)
rT
Tj = 150 °C, sin 180°, 10 ms
Tj = 25 °C, VRRM = 1200 V
Tj = 150 °C, VRRM = 1200 V
Tj = 25 °C, IF = 150 A
Tj = 150 °C, IF = 150 A
Tj = 175 °C, IF = 150 A
Tj = 150 °C
Tj = 150 °C
Tj = 175 °C
Tj = 175 °C
Dynamic Characteristics
Symbol Conditions
trr
Tj = 150 °C, 150 A, 600 V, 3200 A/µs
Err
Tj = 150 °C, 150 A, 600 V, 3200 A/µs
Irrm
Tj = 150 °C, 150 A, 600 V, 3200 A/µs
Thermal Characteristics
Symbol Conditions
Tj
Tstg
Tsolder
Tsolder
Rth(j-c)
10 min.
5 min.
Semitrans Assembly
Mechanical Characteristics
Symbol Conditions
Raster
size
Area total
Anode Metallization
Cathode Metallization
Wire bond
Package
Chips /
Package
Values
1200
98
900
900
175
Unit
V
A
A
A
°C
min.
typ.
14.00
2.14
2.07
1.93
0.90
7.8
0.82
7.40
max. Unit
4050 A²s
0.18
mA
28.00 mA
2.46
V
2.38
V
2.24
V
1.10
V
8.60 mï
0.98
V
8.40 mï
min.
typ.
max. Unit
0.48
µs
8.7
mJ
153
A
min.
typ.
max. Unit
-40
175
°C
-40
175
°C
250
°C
320
°C
0.32
K/W
Values
Unit
9x9
81
bondable (Al)
solderable (Ag/Ni)
Al, typ. diameter = 300 µm
wafer frame
179
mm2
mm²
pcs
SKCD
© by SEMIKRON
Rev. 0 â 16.03.2011
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