SKCD16C060IHD_10 Datasheet, PDF (1/2 Pages) Semikron International – CAL-DIODE

SKCD 16 C 060 I HD
CAL-DIODE
I_F = 50 A
V_RRM = 600 V
Size: 3,97 mm x 3,97 mm
SKCD 16 C 060 I HD
Features
• high current density
• easy paralleling due to a small forward
voltage spread
• positive temperature coefficient
• very soft recovery behavior
• small switching losses
• high ruggedness
• compatible to thick wire bonding
• compatible to standard solder
processes
Typical Applications*
• freewheeling diode for IGBT
Absolute Maximum Ratings
Symbol Conditions
Values
Unit
V_RRM
I_F(AV)
I_FSM
T_jmax
T_j = 25 °C, I_R = 0.2 mA
T_s = 80 °C, T_j = 175 °C
10 ms
T_j = 25 °C
sin 180°
T_j = 150 °C
Electrical Characteristics
Symbol Conditions
600
V
32
A
345
A
320
A
175
°C
min.
typ.
max. Unit
i²t
I_R
V_F
V_(TO)
r_T
T_j = 150 °C, 10 ms, sin 180°
T_j = 25 °C, V_RRM = 600 V
T_j = 150 °C, V_RRM = 600 V
T_j = 25 °C, I_F = 37 A
T_j = 150 °C, I_F = 37 A
T_j = 150 °C
T_j = 150 °C
Dynamic Characteristics
Symbol Conditions
512
A²s
0.20 mA
mA
1.35
V
1.31
V
0.85
V
12.6
mΩ
min.
typ.
max. Unit
t_rr
T_j = 25 °C, 50 A, 300 V, 1500 A/µs
t_rr
T_j = 150 °C, 50 A, 300 V, 1500 A/µs
Q_rr
T_j = 25 °C, 50 A, 300 V, 1500 A/µs
Q_rr
T_j = 150 °C, 50 A, 300 V, 1500 A/µs
I_rrm
T_j = 25 °C, 50 A, 300 V, 1500 A/µs
I_rrm
T_j = 150 °C, 50 A, 300 V, 1500 A/µs
Thermal Characteristics
Symbol Conditions
min.
µs
ns
µC
5.64
µC
A
46.6
A
typ. max. Unit
T_j
T_stg
T_solder
T_solder
R_th(j-s)
-40
-40
10 min.
5 min.
sold. on 0,38 mm DCB, reference point
on copper heatsink close to the chip
1.58
175
°C
175
°C
250
°C
320
°C
K/W
Mechanical Characteristics
Symbol Conditions
Values
Unit
Raster
size
Area total
Anode
Cathode
Wire bond
Package
Chips /
Package
3.97 x 3.97
15.76
bondable (Al)
solderable (Ag/Ni)
Al, diameter ≤ 500 µm
wafer frame
651 (5" Wafer)
mm²
mm²
pcs
SKCD
© by SEMIKRON
Rev. 0 – 18.02.2010
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