SKCD06C120I3 Datasheet, PDF (1/2 Pages) Semikron International – SEMICELL CAL-DIODE

SKCD 06 C 120 I3
CAL-DIODE
I_F = 10 A
V_RRM = 1200 V
Size: 2,44 mm x 2,44 mm
SKCD 06 C 120 I3
Features
• low forward voltage drop combined
with a low temperature dependence
• easy paralleling due to a small forward
voltage spread
• very soft recovery behavior
• small switching losses
• high ruggedness
• compatible to thick wire bonding
• compatible to all standard solder
processes
Typical Applications*
• freewheeling diode for IGBT
• particularly suitable for frequencies > 8
kHz
Absolute Maximum Ratings
Symbol Conditions
Values
Unit
V_RRM
I_F(AV)
I_FSM
T_jmax
T_j = 25 °C, I_R = 0.1 mA
T_s = 80 °C, T_j = 150 °C
10 ms
T_j = 25 °C
sin 180°
T_j = 150 °C
Electrical Characteristics
Symbol Conditions
1200
V
7
A
A
A
150
°C
min.
typ.
max. Unit
i²t
I_R
V_F
V_(TO)
r_T
T_j = 150 °C, 10 ms, sin 180°
T_j = 25 °C, V_RRM = 1200 V
T_j = 125 °C, V_RRM = 1200 V
T_j = 25 °C, I_F = 5 A
T_j = 125 °C, I_F = 5 A
T_j = 125 °C
T_j = 125 °C
Dynamic Characteristics
Symbol Conditions
2.00
1.79
1.18
159.0
A²s
0.10 mA
0.50 mA
2.50
V
2.30
V
V
mΩ
min.
typ.
max. Unit
t_rr
T_j = 25 °C, , 600 V,
t_rr
T_j = 125 °C, , 600 V,
Q_rr
T_j = 25 °C, , 600 V,
Q_rr
T_j = 125 °C, , 600 V,
I_rrm
T_j = 25 °C, , 600 V,
I_rrm
T_j = 125 °C, , 600 V,
Thermal Characteristics
Symbol Conditions
µs
ns
µC
µC
A
A
min.
typ.
max. Unit
T_j
T_stg
T_solder
T_solder
R_th(j-s)
-40
-40
10 min.
5 min.
sold. on 0,38 mm DCB, reference point
on copper heatsink close to the chip
2.46
150
°C
150
°C
250
°C
320
°C
K/W
Mechanical Characteristics
Symbol Conditions
Values
Unit
Raster
size
Area total
Anode
Cathode
Wire bond
Package
Chips /
Package
2.44 x 2.44
5.95
bondable (Al)
solderable (Ag/Ni)
Al, diameter ≤ 500 µm
wafer frame
1720 (5" Wafer)
mm²
mm²
pcs
SKCD
© by SEMIKRON
Rev. 0 – 18.02.2010
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