L6100100 Datasheet, PDF (1/15 Pages) Semikron International – SKYPER32 - TECHNICAL EXPLANATIONS

SKYPER™ 32 - Technical Explanations
SKYPER™ 32
Technical Explanations
Revision 04
Status: preliminary
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This Technical Explanation is valid for the following parts:
part number
L6100100
type
SKYPER™ 32
date code (YYWW)
≥ 0519
Related documents:
title
Data Sheet SKYPER™ 32
≥ 03-06-2005
version
Prepared by: Markus Hermwille
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Content
Application and Handling Instructions...................................................................................................................... 2
Further application support ...................................................................................................................................... 2
General Description................................................................................................................................................. 2
Features of SKYPER™ 32 ...................................................................................................................................... 2
Block diagram.......................................................................................................................................................... 3
Dimensions.............................................................................................................................................................. 3
PIN Array – Primary Side......................................................................................................................................... 4
PIN Array – Secondary Side.................................................................................................................................... 5
Driver Performance ................................................................................................................................................. 6
Insulation ................................................................................................................................................................. 6
Auxiliary Power Supply ............................................................................................................................................ 6
Under Voltage Protection of driver power supply (UVP).......................................................................................... 7
Input Signals............................................................................................................................................................ 8
Short Pulse Suppression (SPS)............................................................................................................................... 8
Failure Management................................................................................................................................................ 8
Shut Down Input (SDI)............................................................................................................................................. 9
Dead Time generation (Interlock TOP / BOT) (DT) ................................................................................................. 9
Dynamic Short Circuit Protection by VCEsat monitoring / de-saturation monitoring (DSCP).................................... 10
Adjustment of DSCP.............................................................................................................................................. 11
High Voltage Diode for DSCP................................................................................................................................ 12
Gate resistors ........................................................................................................................................................ 12
External Boost Capacitors (BC)............................................................................................................................. 13
Application Example .............................................................................................................................................. 13
Mounting Notes ..................................................................................................................................................... 14
Marking.................................................................................................................................................................. 15
Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is
given and no liability is assumed with respect to the accuracy or use of such information. Furthermore, this technical
information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or
implied is made regarding delivery, performance or suitability. Specifications mentioned in this document are subject to
change without notice. This document supersedes and replaces all information previously supplied and may be supersede
by updates.
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2005-06-03 – Rev04
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