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HFW840 Datasheet, PDF (1/7 Pages) SemiHow Co.,Ltd. – 500V N-Channel MOSFET | |||
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April 2016
HFW840
500V N-Channel MOSFET
FEATURES
 Originative New Design
 Superior Avalanche Rugged Technology
 Robust Gate Oxide Technology
 Very Low Intrinsic Capacitances
 Excellent Switching Characteristics
 Unrivalled Gate Charge : 25 nC (Typ.)
 Extended Safe Operating Area
 Lower RDS(ON) È7\S#9GS=10V
 100% Avalanche Tested
BVDSS = 500 V
RDS(on) typ È
ID = 9.0 A
D2-PAK
2
1
3
1.Gate 2. Drain 3. Source
Absolute Maximum Ratings TC=25à
unless otherwise specified
Symbol
Parameter
Value
VDSS
ID
IDM
VGS
EAS
IAR
EAR
dv/dt
Drain-Source Voltage
Drain Current
Drain Current
Drain Current
â Continuous (TC = 25à
)
â Continuous (TC = 100à
)
â Pulsed
Gate-Source Voltage
Single Pulsed Avalanche Energy
(Note 2)
Avalanche Current
(Note 1)
Repetitive Avalanche Energy
(Note 1)
Peak Diode Recovery dv/dt
(Note 3)
500
9.0
5.4
36
Ï30
360
9.0
13.5
4.5
Power Dissipation (TA = 25à
) *
PD
Power Dissipation (TC = 25à
)
- Derate above 25à
3.13
135
1.07
TJ, TSTG
TL
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8â from case for 5 seconds
-55 to +150
300
Thermal Resistance Characteristics
Symbol
Parameter
RÈJC
Junction-to-Case
RÈJA
Junction-to-Ambient *
RÈJA
Junction-to-Ambient
* When mounted on the minimum pad size recommended (PCB Mount)
Typ.
--
--
--
Max.
0.93
40
62.5
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
W
W/à
à
à
Units
à
/W
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