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HFP840 Datasheet, PDF (1/8 Pages) SHANTOU HUASHAN ELECTRONIC DEVICES CO.,LTD – N-Channel Enhancement Mode Field Effect Transistor | |||
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Sep 2011
HFP840
500V N-Channel MOSFET
BVDSS = 500 V
RDS(on) typ È
ID = 9.0 A
FEATURES
 Originative New Design
 Superior Avalanche Rugged Technology
 Robust Gate Oxide Technology
 Very Low Intrinsic Capacitances
 Excellent Switching Characteristics
 Unrivalled Gate Charge : 25 nC (Typ.)
 Extended Safe Operating Area
 Lower RDS(ON) È7\S#9GS=10V
 100% Avalanche Tested
TO-220
1
2
3
1.Gate 2. Drain 3. Source
Absolute Maximum Ratings TC=25à
unless otherwise specified
Symbol
Parameter
Value
VDSS
ID
IDM
VGS
EAS
IAR
EAR
dv/dt
Drain-Source Voltage
Drain Current
Drain Current
Drain Current
â Continuous (TC = 25à°ÍÍ
â Continuous (TC = 100à°ÍÍ
â Pulsed
(Note 1)
Gate-Source Voltage
Single Pulsed Avalanche Energy
(Note 2)
Avalanche Current
(Note 1)
Repetitive Avalanche Energy
(Note 1)
Peak Diode Recovery dv/dt
(Note 3)
500
9.0
5.4
36
Ïͤ͡Í
360
9.0
13.5
4.5
PD
TJ, TSTG
TL
Power Dissipation (TC = 25à°ÍÍ
ÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍÍ͵ÎΣÎÎ¥ÎÍÎÎΠΧÎÍͣͦà°Í
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8â from case for 5 seconds
135
1.07
-55 to +150
300
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
W/à°Í
à°Í
à°Í
Thermal Resistance Characteristics
Symbol
RÈJC
RÈCS
RÈJA
Junction-to-Case
Parameter
Case-to-Sink
Junction-to-Ambient
Typ.
--
0.5
--
Max.
0.93
--
62.5
Units
à°Í ÎÍ
à°ÍÎͶ;ͺ͹ÎÎÍÎͶÎÍͲ͡ÍÎÎΡÍͣ͢͢͡Í
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