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HFP730 Datasheet, PDF (1/8 Pages) SHANTOU HUASHAN ELECTRONIC DEVICES CO.,LTD – N-Channel Enhancement Mode Field Effect Transistor | |||
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June 2005
HFP730
400V N-Channel MOSFET
BVDSS = 400 V
RDS(on) typ = 0.8 Ω
ID = 5.5 A
FEATURES
ï± Originative New Design
ï± Superior Avalanche Rugged Technology
ï± Robust Gate Oxide Technology
ï± Very Low Intrinsic Capacitances
ï± Excellent Switching Characteristics
ï± Unrivalled Gate Charge : 18 nC (Typ.)
ï± Extended Safe Operating Area
ï± Lower RDS(ON) : 0.8 Ω (Typ.) @VGS=10V
ï± 100% Avalanche Tested
TO-220
1
2
3
1.Gate 2. Drain 3. Source
Absolute Maximum Ratings TC=25â unless otherwise specified
Symbol
Parameter
Value
VDSS
Drain-Source Voltage
400
ID
Drain Current
â Continuous (TC = 25â)
5.5
Drain Current
â Continuous (TC = 100â)
3.5
IDM
Drain Current
â Pulsed
(Note 1)
22
VGS
Gate-Source Voltage
±30
EAS
Single Pulsed Avalanche Energy
(Note 2)
330
IAR
Avalanche Current
(Note 1)
5.5
EAR
Repetitive Avalanche Energy
(Note 1)
7.3
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
5.5
PD
TJ, TSTG
TL
Power Dissipation (TC = 25â)
- Derate above 25â
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8â from case for 5 seconds
73
0.58
-55 to +150
300
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
W/â
â
â
Thermal Resistance Characteristics
Symbol
RθJC
RθCS
RθJA
Junction-to-Case
Parameter
Case-to-Sink
Junction-to-Ambient
Typ.
--
0.5
--
Max.
1.71
--
62.5
Units
â/W
â SEMIHOW REV.A0,June 2005
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