HFH9N90Z Datasheet, PDF (1/10 Pages) SemiHow Co.,Ltd. – 900V N-Channel MOSFET

Oct 2016
HFH9N90Z / HFA9N90Z
900V N-Channel MOSFET
Features
‰ Superior Avalanche Rugged Technology
‰ Robust Gate Oxide Technology
‰ Very Low Intrinsic Capacitances
‰ Excellent Switching Characteristics
‰ 100% Avalanche Tested
‰ RoHS Compliant
‰ Built-in ESD Diode
Key Parameters
Parameter
BV_DSS
I_D
R_{DS(on), Typ}
Qg_{, Typ}
Value
900
9
1.12
55
Unit
V
A
ȍ
nC
HFH9N90Z
TO-3P
HFA9N90Z
TO-247
Symbol
S
D
G
S
D
G
Absolute Maximum Ratings T_C=25୅ unless otherwise specified
Symbol
Parameter
TO-3P
TO-247
V_DSS
I_D
I_DM
V_GS
E_AS
I_AR
E_AR
dv/dt
Drain-Source Voltage
Drain Current
Drain Current
Drain Current
– Continuous (T_C = 25୅)
– Continuous (T_C = 100୅)
– Pulsed
(Note 1)
Gate-Source Voltage
Single Pulsed Avalanche Energy
(Note 2)
Avalanche Current
(Note 1)
Repetitive Avalanche Energy
(Note 1)
Peak Diode Recovery dv/dt
(Note 3)
900
9.0
9.0 *
5.7
5.7 *
36
36 *
ρ30
900
9.0
28
4.0
P_D
Power Dissipation (T_C = 25୅)
- Derate above 25୅
280
110
2.22
0.88
V_ESD(G-S)
T_J, T_STG
T_L
Gate source ESD(HBM-C=100pF, R=1.5KŸ
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8” from case for 5 seconds
4
-55 to +150
300
* Drain current limited by maximum junction temperature
Thermal Resistance Characteristics
Symbol
R_șJC
R_șCS
R_șJA
Parameter
Thermal Resistance, Junction-to-Case, Max.
Thermal Resistance, Case-to-Sink, Typ.
Thermal Resistance, Junction-to-Ambient, Max.
TO-3P
0.45
0.24
40
TO-247
1.11
--
40
Unit
V
A
A
A
V
mJ
A
mJ
V/ns
W
W/୅
KV
୅
୅
Unit
୅/W
୅/W
୅/W
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