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HFD4N50 Datasheet, PDF (1/8 Pages) SemiHow Co.,Ltd. – 500V N-Channel MOSFET | |||
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July 2005
HFD4N50 / HFU4N50
500V N-Channel MOSFET
BVDSS = 500 V
RDS(on) typ = 2.0 Ω
ID = 2.6 A
FEATURES
ï± Originative New Design
ï± Superior Avalanche Rugged Technology
ï± Robust Gate Oxide Technology
ï± Very Low Intrinsic Capacitances
ï± Excellent Switching Characteristics
ï± Unrivalled Gate Charge : 13 nC (Typ.)
ï± Extended Safe Operating Area
ï± Lower RDS(ON) : 2.0 Ω (Typ.) @VGS=10V
ï± 100% Avalanche Tested
D-PAK I-PAK
2
1
3
HFD4N50
1
2
3
HFU4N50
1.Gate 2. Drain 3. Source
Absolute Maximum Ratings TC=25â unless otherwise specified
Symbol
Parameter
Value
VDSS
ID
IDM
VGS
EAS
IAR
EAR
dv/dt
Drain-Source Voltage
Drain Current
Drain Current
Drain Current
â Continuous (TC = 25â)
â Continuous (TC = 100â)
â Pulsed
(Note 1)
Gate-Source Voltage
Single Pulsed Avalanche Energy
(Note 2)
Avalanche Current
(Note 1)
Repetitive Avalanche Energy
(Note 1)
Peak Diode Recovery dv/dt
(Note 3)
500
2.6
1.64
10.4
±30
440
2.6
4.5
4.5
PD
TJ, TSTG
TL
Total Power Dissipation (TA=25â) *
Power Dissipation (TC = 25â)
- Derate above 25â
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8â from case for 5 seconds
2.5
45
0.36
-55 to +150
300
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
W
W/â
â
â
Thermal Resistance Characteristics
Symbol
Parameter
RθJC
Junction-to-Case
RθJA
Junction-to-Ambient*
RθJA
Junction-to-Ambient
* When mounted on the minimum pad size recommended (PCB Mount)
Typ.
--
--
--
Max.
2.78
50
110
Units
â/W
â SEMIHOW REV.A0,July 2005
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