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HFD2N60 Datasheet, PDF (1/8 Pages) SemiHow Co.,Ltd. – 600V N-Channel MOSFET | |||
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July 2005
HFD2N60 / HFU2N60
600V N-Channel MOSFET
BVDSS = 600 V
RDS(on) typ = 4.0 Ω
ID = 1.8 A
FEATURES
ï± Originative New Design
ï± Superior Avalanche Rugged Technology
ï± Robust Gate Oxide Technology
ï± Very Low Intrinsic Capacitances
ï± Excellent Switching Characteristics
ï± Unrivalled Gate Charge : 9.0 nC (Typ.)
ï± Extended Safe Operating Area
ï± Lower RDS(ON) : 4.0 Ω (Typ.) @VGS=10V
ï± 100% Avalanche Tested
D-PAK I-PAK
2
1
3
HFD2N60
1
2
3
HFU2N60
1.Gate 2. Drain 3. Source
Absolute Maximum Ratings TC=25â unless otherwise specified
Symbol
Parameter
Value
VDSS
Drain-Source Voltage
600
ID
Drain Current
â Continuous (TC = 25â)
1.8
Drain Current
â Continuous (TC = 100â)
1.1
IDM
Drain Current
â Pulsed
(Note 1)
7.2
VGS
Gate-Source Voltage
±30
EAS
Single Pulsed Avalanche Energy
(Note 2)
150
IAR
Avalanche Current
(Note 1)
1.8
EAR
Repetitive Avalanche Energy
(Note 1)
4.4
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
5.5
PD
TJ, TSTG
TL
Power Dissipation (TA=25 °C) *
Power Dissipation (TC = 25â)
- Derate above 25â
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8â from case for 5 seconds
2.5
44
0.35
-55 to +150
300
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
W
W/â
â
â
Thermal Resistance Characteristics
Symbol
Parameter
RθJC
Junction-to-Case
RθJA
Junction-to-Ambient*
RθJA
Junction-to-Ambient
* When mounted on the minimum pad size recommended (PCB Mount)
Typ.
--
--
--
Max.
2.87
50
110
Units
â/W
â SEMIHOW REV.A0,July 2005
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