2C3960 Datasheet, PDF (1/1 Pages) Semicoa Semiconductor – Chip Type 2C3960 Geometry 0003 Polarity NPN

Chip Type 2C3960
Geometry 0003
Polarity NPN
Data Sheet No. 2C3960
Generic Packaged Part:
2N3960
Chip type 2C3960 by Semicoa Semi-
conductors provides performance
similar to these devices.
Part Numbers:
2N3960, 2N3960UB, SD3960F, SQ3960,
SQ3960F
Product Summary:
APPLICATIONS:
Designed for high-speed current-mode
logic switching.
Features:
Metallization
Bonding Pad Size
Die Thickness
Chip Area
Top Surface
Mechanical Specifications
Top
Al - 15 kÅ min.
Backside
Au - 6.5 kÅ nom.
Emitter
2.7 mils x 2.7 mils
Base
2.7 mils x 2.7 mils
8 mils nominal
16 mils x 16 mils
Silox Passivated
Electrical Characteristics
T_A = 25^oC
Parameter
Test conditions
Min
Max
Unit
BV_CEO
I_C = 10.0 mA
12
---
V dc
BV_CBO
I_C = 10 µA
20
---
V dc
BV_EBO
I_E = 10.0 mA
4.5
---
V dc
I_CEX
V_CE = 10 V, V_EB = 2.0 V
---
5.0
nA
h_FE1
I_C = 1.0 mA dc, V_CE = 1.0 V
25
---
---
h_FE2
I_C = 10 mA dc, V_CE = 1.0 V
40
400
---
h_FE3
I_C = 30 mA dc, V_CE = 1.0 V
25
---
---
V_CE(sat)
I_C = 30 mA dc, I_B = 3.0 mA
---
0.3
V dc
Due to limitations of probe testing, only dc parameters are tested. This must be done with pulse width less
than 300 µs, duty cycle less than 2%.