SML05SC06D3A Datasheet, PDF (1/6 Pages) Seme LAB – SiC SCHOTTKY DIODE

SiC SCHOTTKY DIODE
SML05SC06D3A / SML05SC06D3B
• VR(max) = 600V
• IF(avg) = 5A
• VF(typ) = 1.5V
• DLCC3 Hermetic Ceramic Surface Mount Package Designed as a
Drop In Replacement for “D-5B”/ “E-MELF” Package ^†
• No Reverse Recovery
• No Forward Recovery
• High Reliability Screening Options Available
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise stated)
VRRM _{Peak Repetitive Reverse Voltage}
600V
VRSM _{Surge Peak Reverse Voltage}
600V
IF(AVG) _{Average Forward Current} ⁽¹⁾
5A
IFSM
Non-Repetitive Peak Forward Surge Current ^(3,4)
60A
PD
Total Power Dissipation at ^{TA = 25°C}
2.96 ⁽²⁾
Derate Above TA = 25°C
14.8mW/°C ⁽²⁾
TJ
Junction Temperature Range
-55 to +225°C
Tstg
Storage Temperature Range
-55 to +225°C
THERMAL PROPERTIES
Symbols
Parameters
R_θJSP(IN)
Thermal Resistance, Junction To Solder Pads TSP = 25°C
R_θJA(PCB)⁽²⁾
Thermal Resistance, Junction To Ambient, On PCB
R_θJA(PCB)⁽³⁾
Thermal Resistance, Junction To Ambient, On PCB
Max.
29
67.5
123
Units
°C/W
°C/W
°C/W
Notes
(1) IO1 is rated at 1.75A @ TA = 25°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
TJ(Max) does not exceed 175°C; This equates to R_θJA(PCB) ≤ 68°C/W.
(2) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (25.4mm x 25.4mm) , horizontal in still air.
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.
IO1 is rated at 1.0A @ TA = 25°C for PC boards where R_θJA(PCB) ≤ 125°C/W. Derate at 7.33mA/°C above TA = 25°C in this case.
(4) MIL-STD-750 Method 4066.4 Condition A1. I_O = 1A, V_RWM = 600V, V_RSM = 600V, ten surges of 8.3mS each at 1 minute intervals, TA = 25°C.
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.
Semelab ltd reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
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Document Number 9166
Issue 2
Page 1 of 6