TB2S Datasheet, PDF (1/2 Pages) Galaxy Semi-Conductor Holdings Limited – SILICON BRIDGE RECTIFIERS

Elektronische Bauelemente
TB2S ~ TB10S
Voltage 200V ~ 1000V
1.0 Amp Silicon Bridge Rectifiers
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
FEATURES
 Glass passivated chip junction
 High surge overload rating：30A peak
 Save space on printed circuit boards
 High temperature soldering guaranteed：
260°C / 10 seconds at 5 lbs. (2.3 kg) tension
TBS
-+
A
MECHANICAL DATA
 Case: Molded plastic body over passivated junctions
 Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
 Polarity: Polarity symbols marked on body
Dimensions in inches and (millimeters)
 Mounting position: Any
PACKAGE INFORMATION
Package
MPQ
TBS
4K
Leader Size
13 inch
B
F
C
D
E
G
H
I
REF.
A
B
C
D
E
Millimeter
Min. Max.
4.25 4.55
4.85 5.15
1.15 1.45
0.60 0.70
3.90 4.10
REF.
F
G
H
I
Millimeter
Min.
6.30
0.05
Max.
6.70
0.15
4.25 4.55
0.50 0.70
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(Rating 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.)
Parameter
Symbol
TB2S
Part Number
TB4S TB6S TB8S
TB10S
Maximum Recurrent Reverse Voltage
V_RRM
200
400
600
800
1000
Maximum RMS Voltage
V_RMS
140
280
420
560
700
Maximum DC Blocking Voltage
Maximum Instantaneous Forward Voltage @
I_FM=0.4A
Maximum Average Forward Rectified Current
@ T_L=100°C
V_DC
V_F
I_F(AV)
200
400
600
800
1000
0.95
0.8 ¹
1.0 ²
Peak Forward Surge Current, 8.3ms single
half sine-wave superimposed on rated load
I_FSM
30
(JEDEC method)
On aluminum
Typical thermal resistance substrate
junction to ambient
On glass-epoxy
R_θJA
substrate
62.5
80
Typical thermal resistance junction to lead
Maximum DC Reverse Current at Rated DC
Blocking Voltage@ T_A=25°C
Operating & Storage Temperature Range
Notes:
1. On glass epoxy P.C.B.
2. On aluminum substrate.
R_θJL
I_R
T_J,T_STG
25
10
-55~150
Unit
V
V
V
V
A
A
°C / W
　A
°C
http://www.SeCoSGmbH.com/
14-Feb-2012 Rev. B
Any changes of specification will not be informed individually.
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