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SSPS7630N Datasheet, PDF (1/4 Pages) SeCoS Halbleitertechnologie GmbH – Dual-N Channel Mode Power MOSFET
Elektronische Bauelemente
SSPS7630N
9.4 A, 30 V, RDS(ON) 19 mΩ
Dual-N Channel Mode Power MOSFET
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
DESCRIPTION
These miniature surface mount MOSFETs
utilize a high cell density trench process to
provide low RDS(on) and to ensure minimal
power loss and heat dissipation. Typical
applications are DC-DC converters and power
management In portable and battery-powered
products such as computers, printers, PCMCIA
cards, cellular and cordless telephones.
DFN3*3-8PP
FEATURES
Low RDS(on) provides higher efficiency and
extends battery life.
Low thermal impedance copper leadframe
SOP-8 saves board space.
Fast switching speed.
High performance trench technology.
PACKAGE INFORMATION
Package
MPQ
DFN3*3-8PP
3K
Leader Size
13’ inch
REF.
A
B
C
D
E
F
Millimeter
Min. Max.
3.0 BSC.
3.2 BSC.
0.2 0.35
0.65 BSC.
0.1 0.25
3.0 BSC
REF.
G
H
I
J
K
L
Millimeter
Min. Max.
0.7
0.9
1.1 BSC.
2.475 BSC
1.8 BSC.
0.3
0.5
0.52 BSC
S
D
G
D
S
D
G
D
MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
Continuous Drain Current 1
TA = 25°C
ID
TA = 70°C
Pulsed Drain Current 2
IDM
Continuous Source Current (Diode Conduction) 1
IS
Total Power Dissipation 1
TA = 25°C
PD
TA = 70°C
Operating Junction & Storage Temperature Range
TJ, TSTG
Thermal Resistance Ratings
Thermal Resistance Junction-ambient (Max.) 1 t≦10 sec
Steady State
Notes:
1. Surface Mounted on 1” x 1” FR4 Board.
2. Pulse width limited by maximum junction temperature.
RθJC
RθJA
http://www.SeCoSGmbH.com/
28-Jun-2013 Rev. A
Ratings
30
±20
9.4
6.8
30
2.1
2.5
1.3
-55 ~ 150
83
120
Unit
V
V
A
A
A
A
W
W
°C
°C / W
°C / W
Any changes of specification will not be informed individually.
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