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SSG4835P_15 Datasheet, PDF (1/4 Pages) SeCoS Halbleitertechnologie GmbH – P-Ch Enhancement Mode Power MOSFET
Elektronische Bauelemente
SSG4835P
-9.5 A, -30 V, RDS(ON) 19 m
P-Ch Enhancement Mode Power MOSFET
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
DESCRIPTION
These miniature surface mount MOSFETs
utilize high cell density process. Low RDS(on)
assures minimal power loss and conserves
energy, making this device ideal for use in
power management circuitry. Typical
applications are PWMDC-DC converters, power
management in portable and battery-powered
products such as computers, printers, battery
charger, telecommunication power system, and
telephones power system.
FEATURES
 Low RDS(on) provides higher efficiency and
extends battery life.
 Miniature SOP-8 surface mount package
saves board space.
 High power and current handling capability.
 Extended VGS range (±20) for battery pack
applications.
PACKAGE INFORMATION
Package
MPQ
SOP-8
2.5K
Leader Size
13’ inch
SOP-8
B
A
H
G
LD
M
C
N
JK
FE
REF.
A
B
C
D
E
F
G
Millimeter
Min. Max.
5.80 6.20
4.80 5.00
3.80 4.00
0°
8°
0.40 0.90
0.19 0.25
1.27 TYP.
REF.
H
J
K
L
M
N
Millimeter
Min. Max.
0.35 0.49
0.375 REF.
45°
1.35 1.75
0.10 0.25
0.25 REF.
S
D
S
D
S
D
G
D
MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current 1
TA = 25°C
TA = 70°C
Pulsed Drain Current 2
Continuous Source Current (Diode Conduction) 1
Total Power Dissipation 1
TA = 25°C
TA = 70°C
Operating Junction & Storage Temperature Range
Symbol
VDS
VGS
ID
IDM
IS
PD
TJ, TSTG
Thermal Resistance Ratings
Thermal Resistance Junction-Ambient (Max.) 1 t ≦ 10 sec
Steady State
Notes
1. Surface Mounted on 1” x 1” FR4 Board.
2. Pulse width limited by maximum junction temperature.
RθJA
http://www.SeCoSGmbH.com/
14-Jul-2014 Rev. C
Ratings
-30
±20
-9.5
-8.3
-50
-4
3.1
2.2
-55 ~ 150
40
80
Unit
V
V
A
A
A
A
W
W
°C
°C / W
°C / W
Any changes of specification will not be informed individually.
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