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SM10200DS1_15 Datasheet, PDF (1/2 Pages) SeCoS Halbleitertechnologie GmbH – 10.0 Amp. Schottky Barrier Rectifiers
Elektronische Bauelemente
SM10200DS1
Voltage 200V
10.0 Amp. Schottky Barrier Rectifiers
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
FEATURES
 Low forward voltage drop
 High current capability
 High reliability
 High surge current capability
 Epitaxial construction
MECHANICAL DATA
 Case: Molded plastic
 Epoxy: UL94V-0 rate flame retardant
 Lead: Lead solderable per MIL-STD-202
method 208
 Polarity: As Marked
 Mounting position: Any
 Weight: 0.7 grams
PACKAGE INFORMATION
Package
MPQ
TO-252
2.5K
Leader Size
13 inch
TO-252 (D-Pack)
A
B
C
D
GE
K
HF
N
O
P
M
J
REF.
Millimeter
Min. Max.
REF.
Millimeter
Min. Max.
A 6.35 6.90 J
2.30 REF.
B 4.95 5.50 K 0.64 1.14
C 2.10 2.50 M 0.50 1.14
D 0.43 0.9 N 1.3 1.8
E 6.0 7.5 O 0 0.13
F
2.80 REF
P
0.58REF.
G 5.40 6.40
H 0.60 1.20
Pin 2
Pin 1
Pin 3
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(Rating 25°C ambient temperature unless otherwise specified. Single phase half wave, 60Hz, resistive or inductive load.
For capacitive load, de-rate current by 20%.)
Parameter
Symbol
Rating
Maximum Repetitive Peak Reverse Voltage
VRRM
Maximum RMS Voltage
VRMS
Maximum DC Blocking Voltage
VDC
Maximum Average Forward Rectified Current
IF
Peak Forward Surge Current @8.3ms Single Half Sine-Wave
Superimposed On Rated Load
IFSM
Maximum Instantaneous Forward Voltage @10A
VF
Maximum DC Reverse Current at Rated DC TA=25°C
Blocking Voltage 4
TA=100°C
IR
Typical Junction Capacitance 1
CJ
Typical Thermal Resistance 2
RθJC
Typical Thermal Resistance 3
RθJA
Operating & Storage Temperature
TJ, TSTG
Note:
1.
2.
3.
4.
Measured at 1MHz and applied reverse voltage of 5.0V D.C.
Thermal Resistance Junction to Case. FR4 Board Heat sink size: 10*10*0.2mm.
Thermal Resistance Junction to Ambient.
Pulse Test : Pulse Width≦300μs Duty Cycle≦2%
200
140
200
10
180
0.92
0.2
10
250
10
95.8
-55~150
Unit
V
V
V
A
A
V
mA
pF
°C / W
°C
http://www.SeCoSGmbH.com/
27-Mar-2014 Rev. E
Any changes of specification will not be informed individually.
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